Crucial and Basic Precautions |  Generally Precautions |

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Products

1.Circuit design precautions

1. Check the rated performance
   
   After checking the operation and installation environments, design the circuit so that it falls within the rated performance range stipulated in the catalog specification.
   
   
   
2. Operating temperature and ripple current
   
   1. Set the operating temperature so that it falls within the range stipulated in the catalog specification.
   2. Do not apply current that exceeds the allowable ripple current in the catalog.
      
      
3. Leakage current
   
   Even when the soldering conditions fall within the range of the catalog specification, the leakage current increases slightly.
   It also increases slightly during high temperature, no-load, moisture-proof no-load, and temperature cycling tests with no voltage applied.
   In cases such as these, leakage current will decrease by applying voltage in conditions below the maximum operating temperature.
   
   
   
   
4. Applied voltage Considerations
   
   1. Make sure the sum of the peak DC voltage and ripple voltage values does not exceed the rated voltage.
   2. When the DC voltage is low, set it so the negative ripple voltage peak value does not become a reverse voltage that exceeds 10% of the rated voltage.
   3. Operate the FPCAP within 20% of the rated voltage for application of reverse voltage during the transient phenomena caused when the power is turned off or the source is switched. Operate it within 10% of the rated voltage when reverse voltage is applied continuously.
      
      
5. Reduction of failure stress
   
   The main failure mode of the FPCAP is in the open mode primarily caused by an electrostatic capacitance drop.
   Random short circuit mode failures occur rarely.
   The time it takes to reach the failure mode can be extended by using the FPCAP with reduced ambient temperature, ripple current and applied voltage.
   
   
   
6. Capacitor insulation
   
   1. Insulation is not guaranteed.
   2. Be sure to completely separate the case, negative electrode terminal and positive electrode terminal from adjacent components and PC board traces.
      
      
7. Operating environment
   Do not use the FPCAP in the following environments
   
   
   1. Places where it can come into direct contact with water or salt water and places where condensation may form.
   2. Places filled with noxious gasses such as: hydrogen sulfide, sulfurous acid, nitrous acid, chlorine, ammonia, etc.
   3. Places exposed to ozone, ultraviolet rays and radiation.
   4. Where severe vibration or shock which exceeds the condition specified in the specification sheets.
      
      
8. Assembly Conditions Considerations
   
   In designing a circuit, the following conditions should be checked before the FPCAP is mounted on the PC board.
   
   
   1. The pitch and diameter of PCB holes to which the FPCAP is mounted, shall be designed in conformance with the dimensional tolerance stipulated in the catalog specifications.
      
      
9. PC board
   
   Avoid locating heat-generating components around the FPCAP and on the underside of the PC board under the FPCAP.
   
   
   
10. Parallel connection
    
    When used in a parallel connection with another capacitor, carefully select the type of capacitor.
    
    
    
11. Other
    
    1. Electrical characteristics are affected by fluctuations in temperature and frequency.
    2. When mounting the FPCAP on a double-sided PC board, design the board so that extra PC board holes are not located underneath the FPCAP.
       
       

1. Things to know before mounting
   
   1. Do not reuse the FPCAP that has already been assembled in a device and energized.
      Excluding the FPCAP that has been removed for measuring electrical characteristics during a periodic inspection, they cannot be reused.
   2. Leakage current may increase if the part has been stored for a long period of time.
      In this case, use after voltage treatment under the rated voltage.
      
      
2. Mounting-1
   
   1. Mount after checking the capacitance and the rated voltage.
   2. Mount after checking the polarity.
   3. Do not drop on the floor and do not use parts that have been dropped.
   4. Do not deform and then mount.
      
      
3. Mounting-2
   
   1. Mount after checking the match between the lead pitch and the PC board holes pitch.
   2. When an automatic insertion equipment is used to clinch the lead wires, make sure it is set correctly.
   3. Be careful of the shock force that can be produced by the automatic insertion equipment.
   4. Do not apply excessive external force to the lead wires, the FPCAP itself, or the electrode terminals.
      
      
4. Soldering with a soldering iron
   
   1. Set the soldering conditions (temperature, time) so that they fall within the range stipulated by the catalog specification.
   2. When the lead wire terminal must be processed because the terminal spacing and the PC board holes spacing do not match, process it before soldering so that no stress is applied to the FPCAP itself.
   3. Do not subject the FPCAP itself to excessive stress when soldering with a soldering iron.
   4. When a soldering iron is used to repair the FPCAP that has already been soldered once and needs to be removed, do it after the solder has been completely melted so that no stress is applied to the FPCAP terminals.
   5. Do not let the tip of the soldering iron touch the FPCAP itself.
   6. The amount of leakage current after soldering may increase a slightly (from a few μA to several hundred μA) depending on the soldering condition (preheating and solder temperature and time, PC board material and thickness, etc.)
      The leakage current can be reduced by applying voltage.
      
      
5. Flow soldering (Radial lead type)
   
   1. Never submerge the FPCAP in molten solder. Use the PC board to protect the FPCAP and only solder the opposite side of the board that the FPCAP is mounted on.
   2. Set the soldering conditions (soldering temperature, terminal submersion time) so that they fall within the range stipulated by the catalog specification. The amount of leakage current after soldering may increase slightly (from a few μA to several hundred μA) depending on the soldering conditions (preheating and solder temperature and time, PC board material and thickness, etc.). The leakage current can be reduced through self-repair by applying voltage.
   3. Take care that flux does not adhere to any place other than the terminals.
   4. When soldering, take care that other components do not fall over and touch the FPCAP.
   5. Flow soldering under extremely abnormal conditions may reduce the electrostatic capacity of products before or after soldering.
6. Reflow soldering (SMD type)
   
   Do not use reflow soldering for Radial lead type (Through Hole).
   
   
   
7. Handling after soldering
   
   1. Do not tilt, bend or twist the FPCAP after it has been soldered on the PC board.
   2. Do not use the FPCAP as a handle to move the PC board after it has been attached to it.
   3. Do not bump the FPCAP with objects after it has been soldered to the PC board. Make sure the FPCAP does not touch other PC boards or components.
   4. Do not subject to excessive stress after it has been soldered to the PC board.
8. Washing the PC board
   
   Check the following items before washing the PC board with these detergents; high quality alcohol-based cleaning fluid such as Pine-αST-100S, clean thru 750H, 750L, 750K, or Techno Care FRW14 through 17; or detergents including substitute Freon such as AK-225AES and IPA.
   
   1. Use immersion or ultrasonic wave to clean for a total of less than five minutes.
   2. The temperature of the cleaning fluid should be less than 60℃.
   3. Watch for contamination of the detergent (conductivity, pH, specific gravity, water content, etc.).
   4. After cleaning do not store in a location subject to gases from the cleaning fluid or in an airtight container. Dry the PC board and the FPCAP using hot air (less than the maximum operating temperature).
   5. Please contact our company for details about detergents and cleaning methods, and about detergents other than those listed above.
      
      
9. Fixatives and coatings
   
   1. Select appropriate material for the FPCAP marking material and sealant. In particular, make sure the fixative, coating and thinner do not contain acetone or toluene.
   2. Before applying a fixative or coating, completely remove any flux residue and foreign matter from the area where the PC board and the FPCAP are to be joined together.
   3. Allow any detergent to dry before applying the fixative or coating.
   4. Please contact our company for fixative and coating heat curing conditions.

1. Do not directly touch the FPCAP terminals.
2. Do not use electric conductors to cause a short circuit between the FPCAP terminals. Do not subject the FPCAP to conductive solutions.
3. Check the installation environment of the board on which the FPCAP is mounted.
4. Age the board at conditions that fall below the capacitor ratings.
5. It is recommended that the board be used at room temperature and in ordinary humidity. For details, refer to the Operating Precaution Guidelines for the EIAJ RCR-2367C. (Safety Application Guide for fixed aluminum electrolytic capacitors for use in electronic equipment.)
   No part of this publication shall be reproduced without prior written permission of the publisher.

1. In the event that a short circuit causes the current to become relatively small (less than approximately 3A for φ10 and less than approximately 1A for φ6.3), the FPCAP itself will generate some heat, but the appearance will not be affected even when electricity is supplied continuously. However, if there is a short circuit and the current value exceeds the above mentioned values, the temperature inside the FPCAP will increase.
   When the temperature exceeds approximately 200℃ the internal pressure will increase, and an odorous gas will be released. In this case, do not allow contact with your face and hands.
2. If a short circuit occurs and an odorous gas is released, either turn off the device’s main power or unplug the power cord from the outlet.
3. If a short circuit should occur, it may take anywhere from a few seconds to a few minutes until an odorous gas develops, depending on the conditions. Design the device so that a power protection circuit works during this time period.
4. If the gas gets in your eyes, rinse them immediately. If it has been inhaled, gargle with water immediately.
5. When the polymer or gas of the polymer comes in contact with your skin, wash it off with soap and water.
6. The electrolyte, separator paper, rubber and tube used in the FPCAP are all combustible. When the current value is extraordinarily high during a short circuit, and assuming the worst possibility, the shorted-out section in the lead wire or inside the capacitor could create a spark, and cause the resin or tube to catch fire.
   Give due consideration to the capacitors mounting methods, mounting positions, pattern design etc.

1. Do not store at high temperatures and high humidity. Store them in a location that is not subject to direct sunlight, has low temperature and humidity (generally, temperature between 15 and 35℃ and a relative humidity between 45 and 75%).
2. Store in an airtight plastic bag to keep the leads in good condition.
3. To keep the leads in good condition, store lead-type the FPCAP for no more than one year.
4. Do not store in places where water, salt water or oil can directly fall on them, or places where condensation may form.
5. Do not store in places filled with noxious gas (hydrogen sulfide, sulfurous acid, nitrous acid, chlorine, ammonia, etc.).
6. Do not store in places exposed to ozone, ultraviolet rays and radiation.